NXG-909 Rework Gel
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A halide free and halogen free, clear residue rework gel for the rework of SMT devices and conventional through hole devices. Developed for excellent performance on all Lead-Free finishes. Exceeds the requirements of J-STD-004B type ROL0
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Halide Free Halogen Free |
ROL0 J-STD-004B |
10grm, 30grm syringes
(automatic / manual)
50g, 100g, 250g, 500g, 1kg tubs
0.3Kg Cart (12oz)
Can be used as supplied, or with needles/tips for easy application.
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Future HF Rework Gel
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A halide free, clear residue rework gel for the rework of SMT devices and conventional through hole devices. Exceeds the requirements of J-STD-004 ROL0
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Halide Free |
ROL0 J-STD-004 |
10grm, 30grm syringes
(automatic / manual)
50g, 100g, 250g, 500g, 1kg tubs
0.3Kg Cart (12oz)
Can be used as supplied, or with needles/tips for easy application.
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Future HD Rework Gel
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A similar product to the Future HF rework gel but with slight halide activation.
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< 0.5% |
ROL1 J-STD-004 |
10grm, 30grm syringes
(automatic / manual)
50g, 100g, 250g, 500g, 1kg tubs
0.3Kg Cart (12oz)
Can be used as supplied, or with needles/tips for easy application.
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Future 315 Low Residue Rework Flux
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A low residue, no clean flux suitable for rework applications. Future 315 is a 2% solids, colophony free and halide free flux.
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Halide Free Halogen Free |
ROL0 J-STD-004 |
100ml, 0.5L, 1L bottles |
Future 315 Flux Pens
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Flux pens are filled with Future 315 Low residue no clean flux.
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Halide Free Halogen Free |
ROL0 J-STD-004 |
Sold Separately Packs of 5 |
De-Solder Wick (Solder Braid)
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De-solder wicks for the removal of solder from the circuit board during the repair operation.
Size 00, AA, AB, BB
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Not applicable |
Not applicable |
1.5m, 15m and 25m |
Fine Rework Cored Solder Wires
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A range of fine cored solder wires suitable for all CSP and fine pitch component rework applications. Wires include Nexus, Future and Autosol.
Gauges from 0.457mm to 0.274mm.
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Halide Free & Halide Activated |
Dependent on wire |
50g, 100g, 250g, 500g, 1kg reels |